• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A transmitter-receiver unit is disclosed wherein a frame is provided with solder-rise preventing means between a circuit board and retaining portions, thereby preventing solder from rising up to the retaining portions. Thus, the engagement between engaging holes and the retaining portions is ensured in comparison with the prior art. The transmitter-receiver unit permits a cover to be mounted positively to the frame and is suitable for the reduction of size and weight.
    公开号:US20010009503A1
    申请号:US09/758,569
    申请日:2001-01-10
    公开日:2001-07-26
    发明作者:Yoshikiyo Watanabe
    申请人:Alps Electric Co Ltd；
    IPC主号:H05K9-0032
    专利说明:
    [0001] 1. Field of the Invention [0001]
    [0002] The present invention relates to a transmitter-receiver unit used in a portable telephone. [0002]
    [0003] 2. Description of the Related Art [0003]
    [0004] A conventional transmitter-receiver unit will now be described with reference to FIGS. 4 and 5. On an upper surface of a circuit board [0004] 21 which is a printed circuit board there are formed electrically conductive patterns 22, and electric components 23 such as resistors, capacitors and IC parts are put on the upper surface of the circuit board 21 and are soldered to the conductive patterns 22 to form a desired circuit.
    [0005] A frame [0005] 24, which is formed in a rectangular shape using a metal, comprises four side walls 24 a and upper and lower openings 24 b. The frame 24 is further provided with a plurality of retaining portions 24 c on the side walls 24 a, the retaining portions 24 c being formed by sticking out the frame 24 outwards from the interior.
    [0006] A circuit portion which includes desired electric components [0006] 23 on the circuit board 21 is positioned inside the frame 24 and in this state a lower end portion of the frame 24 is put on the circuit board 21 and is soldered at 25 throughout the whole circumference thereof to the conductive patterns 22. Thus, the frame 24 is surface-mounted onto the circuit board 21.
    [0007] A metallic cover [0007] 26, which is in the shape of a rectangular box, has a flat plate-like upper surface portion 26 a, mounting pieces 26 b bent from the four sides of the upper surface portion 26 a, and engaging holes 26 c formed in the vicinity of end portions of the mounting pieces 26 b.
    [0008] The upper surface portion [0008] 26 a of the cover 26 covers the upper opening 24 b of the frame 24, and with the mounting pieces 26 b positioned on outer surfaces of the side walls 24 a, the engaging holes 26 c are fitted on the retaining portions 24 c, whereby the cover 26 is mounted to the frame 24. Thus, the desired circuit portion is shielded electrically by both cover 26 and frame 24.
    [0009] The conventional transmitter-receiver unit is constructed as above. In the same unit, for mounting the frame [0009] 24 to the circuit board 21, first the lower end portion of the frame 24 is put on creamy solder (not shown) applied onto the conductive patterns 22 and then the circuit board 21 with the frame 24 thereon is conveyed into a heating furnace to melt the creamy solder, allowing the lower end portion of the frame 24 and the conductive patterns 22 to be soldered at 25.
    [0010] In the conventional frame [0010] 24, however, the surfaces of the side walls 24 a between the retaining portions 24 c and the circuit board 21 are straight surfaces, so upon melting of the creamy solder, the solder 25 rises up to the retaining portions 24 c, as shown in FIGS. 4 and 5, so that the engagement between the engaging holes 26 c and the retaining portions 24 c becomes shallow and insufficient and the cover 26 may become disengaged from the frame 24 or it may be impossible to effect the engagement of the cover with the frame.
    [0011] Particularly in the case of a portable telephone, since the reduction of size and weight is required, an attempt to reduce the height of the frame [0011] 24 for the attainment of size and weight reduction encounters the necessity of shortening the length of the side walls 24 a between the retaining portions 24 c and the circuit board 21, resulting in that the rise of the solder 25 up to the retaining portions 24 c becomes more marked and the engagement between the engaging holes 26 c and the retaining portions 24 c becomes shallower and insufficient or may become impossible. SUMMARY OF THE INVENTION
    [0012] Accordingly, it is an object of the present invention to provide a transmitter-receiver unit which ensures mounting of a cover to a frame and which is suitable for the reduction of size and weight. [0012]
    [0013] For achieving the above-mentioned object, according to the first means adopted by the present invention there is provided a transmitter-receiver unit comprising a circuit board having electrically conductive patterns, a metallic frame having retaining portions, the metallic frame being put and surface-mounted onto the circuit board, and a cover which covers an upper opening of the frame and which is engaged with the retaining portions. The frame is provided with solder-rise preventing means between the circuit board and the retaining portions. [0013]
    [0014] According to the second means adopted by the present invention there is provided, in combination with the above first means, a transmitter-receiver unit wherein the solder-rise preventing means are formed by convex portions provided on the frame. [0014]
    [0015] According to the third means adopted by the present invention there is provided, in combination with the above first means, a transmitter-receiver unit wherein the solder-rise preventing means are formed by concave portions provided in the frame. [0015] BRIEF DESCRIPTION OF THE DRAWINGS
    [0016] FIG. 1 is a sectional view of a transmitter-receiver unit according to the first embodiment of the present invention; [0016]
    [0017] FIG. 2 is an enlarged sectional view of a principal portion thereof; [0017]
    [0018] FIG. 3 is an enlarged sectional view of a principal portion of a transmitter-receiver unit according to the second embodiment of the present invention; [0018]
    [0019] FIG. 4 is a sectional view of a conventional transmitter-receiver unit; and [0019]
    [0020] FIG. 5 is an enlarged sectional view of a principal portion thereof. [0020] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
    [0021] Transmitter-receiver units embodying the present invention will be described hereinunder with reference to the accompanying drawings, in which FIG. 1 is a sectional view of a transmitter-receiver unit according to the first embodiment of the invention, FIG. 2 is an enlarged sectional view of a principal portion thereof, and FIG. 3 is an enlarged sectional view of a principal portion of a transmitter-receiver unit according to the second embodiment of the invention. [0021]
    [0022] The construction of the transmitter-receiver unit according to the first embodiment of the invention will now be described with reference to FIGS. 1 and 2. Electrically conductive patterns [0022] 2 are formed on an upper surface of a circuit board 1 which is a printed circuit board and electric components 3 such as resistors, capacitors and IC parts are put on the upper surface of the circuit board 1 and are soldered to the conductive patterns 2 to form a desired circuit.
    [0023] A metallic frame [0023] 4, which is formed in a rectangular shape, comprises four side walls 4 a and upper and lower openings 4 b. The frame 4 is also provided with a plurality of retaining portions 4 c on the side walls 4 a, the retaining portions 4 c being formed by sticking out the frame 4 outwards from the interior.
    [0024] The frame [0024] 4 is further provided with a plurality of convex portions 4 d between the lower end portions of the side walls 4 a of the frame 4 and the retaining portions 4 c, thereby constituting a plurality of solder-rise preventing means H, the convex portions 4 d being formed by sticking out the frame 4 outwards from the interior.
    [0025] A circuit portion which includes desired electric components [0025] 3 on the circuit board 1 is positioned inside the frame 4 and in this state a lower end portion of the frame 4 is put on the circuit board 1 and is soldered at 5 throughout the whole circumference thereof to the conductive patterns 2. Thus, the frame 4 is surface-mounted onto the circuit board 1.
    [0026] A metallic cover [0026] 6, which is in the shape of a metallic box, has a flat plate-like upper surface portion 6 a, mounting pieces 6 b bent from the four sides of the upper surface portion 6 a, and engaging holes 6 c formed in the vicinity of end portions of the mounting pieces 6 b.
    [0027] The upper surface portion [0027] 6 a of the cover 6 covers the upper opening 4 b of the frame 4, and with the mounting pieces 6 b positioned on outer surfaces of the side walls 4 a, the engaging holes 6 c are fitted on the retaining portions 4 c, whereby the cover 6 is mounted to the frame 4. Thus, the desired circuit portion is shielded electrically by both cover 6 and frame 4.
    [0028] For mounting the frame [0028] 4 to the circuit board 1 in the transmitter-receiver unit of this embodiment, first the lower end portion of the frame 4 is put on creamy solder (not shown) applied onto the conductive patterns 2 and then the circuit board 1 with the frame 4 thereon is conveyed into a heating furnace to melt the creamy solder, allowing the lower end portion of the frame 4 and the conductive patterns 2 to be soldered at 5.
    [0029] In the frame [0029] 4 of this embodiment, since solder-rise preventing means H are formed between the retaining portions 4 c and the circuit board 1, the rise of the solder 5 is prevented by the solder-rise preventing means H upon melting of the creamy solder and the solder 5 does not reach the retaining portions 4 c, as shown in FIGS. 1 and 2. Consequently, the engagement between the engaging holes 6 c and the retaining portions 4 c is ensured and there is no fear of disengagement of the cover 6 nor is there any fear of the cover becoming unengageable.
    [0030] Particularly, even if the side walls [0030] 4 a between the retaining portions 4 c and the circuit board 1 are made shorter to meet the requirement for the reduction of size and weight of a portable telephone, the rise of the solder 5 up to the retaining portions 4 c is prevented by the solder-rise preventing means H and the solder 5 does not reach the retaining portions 4 c, thus ensuring the engagement between the engaging holes 6 c and the retaining portions 4 c.
    [0031] Referring now to FIG. 3, there is illustrated a transmitter-receiver unit according to the second embodiment of the present invention. In this second embodiment, between the lower end portion of the side walls [0031] 4 a of the frame 4 and the retaining portions 4 c, a plurality of concave portion 4 e are formed in the outer surfaces of the side walls 4 a by sticking out the frame 4 inwards from the exterior, thereby constituting a plurality of solder-rise preventing means H.
    [0032] Other constructional points are the same as in the above first embodiment, so the same components as in the first embodiment are here identified by the same reference numerals as in the first embodiment and explanations thereof will be omitted. [0032]
    [0033] In this second embodiment, since solder-rise preventing means H are constituted by the concave portions [0033] 4 e between the retaining portions 4 c and the circuit board 1, the rise of the solder 5 is prevented by the solder-rise preventing means H upon melting of the creamy solder and the solder 5 does not reach the retaining portions 4 c, as shown in FIG. 3. Consequently, the engaging holes 6 c and the retaining portions 4 c are firmly engaged with each other and there is no fear of disengagement of the cover 6 nor is there any fear of the cover becoming unengageable.
    [0034] As set forth above, in the transmitter-receiver unit according to the present invention, since the solder-rise preventing means H are formed between the circuit board [0034] 1 and the retaining portions 4 c, the rise of the solder 5 is prevented by the solder-rise preventing means H and the solder 5 does not reach the retaining portions 4 c. Consequently, in comparison with the prior art, the engagement between the engaging holes 6 c and the retaining portions 4 c is ensured.
    [0035] Moreover, even if the side walls [0035] 4 a between the retaining portions 4 c and the circuit board 1 are made short to meet the requirement for the reduction of size and weight of a portable telephone, the presence of the solder-rise preventing means H prevents the solder 5 from rising up to the retaining portions 4 c and thus the solder 5 does not reach the retaining portions 4 c. Consequently, the engagement between the engaging holes 6 c and the retaining portions 4 c is ensured and the transmitter-receiver unit so constructed is suitable for the reduction of size and weight.
    [0036] Further, since the solder-rise preventing means H are formed by the convex portions [0036] 4 d on the frame 4, there can be provided a transmitter-receiver unit whose construction is simple and which is high in productivity and less expensive.
    [0037] Likewise, since the solder-rise preventing means H are formed by the concave portions [0037] 4 e in the frame 4, there can be provided a transmitter-receiver unit which is simple in construction, high in productivity and less expensive.
    权利要求:
    Claims (3)
    [1" id="US-20010009503-A1-CLM-00001] 1. A transmitter-receiver unit comprising:
    a circuit board having electrically conductive patterns;
    a metallic frame having retaining portions, the metallic frame being put and surface-mounted onto the circuit board; and
    a cover which covers an upper opening of the frame and which is engaged with the retaining portions,
    wherein the frame is provided with solder-rise preventing means between the circuit board and the retaining portions.
    [2" id="US-20010009503-A1-CLM-00002] 2. A transmitter-receiver unit according to
    claim 1 , wherein the solder-rise preventing means are formed by convex portions provided on the frame.
    [3" id="US-20010009503-A1-CLM-00003] 3. A transmitter-receiver unit according to
    claim 1 , wherein the solder-rise preventing means are formed by concave portions provided in the frame.
    类似技术:
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    同族专利:
    公开号 | 公开日
    EP1121006B1|2007-10-03|
    CN1319977A|2001-10-31|
    KR100385103B1|2003-05-23|
    DE60036600D1|2007-11-15|
    KR20010076365A|2001-08-11|
    EP1121006A3|2003-05-21|
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    EP1121006A2|2001-08-01|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US9313912B2|2010-06-28|2016-04-12|Panasonic Intellectual Property Management Co., Ltd.|Electronic device storage case|
    US20160135282A1|2014-11-07|2016-05-12|Kabushiki Kaisha Toshiba|Electronic apparatus|DE3233620C2|1982-09-10|1984-07-26|Standard Elektrik Lorenz Ag, 7000 Stuttgart|Circuit board arrangement with a circuit board and a metal wall attached to it by means of soldering points|
    JPH01315167A|1988-03-01|1989-12-20|Oki Electric Ind Co Ltd|Semiconductor device|
    JPH05283887A|1992-03-31|1993-10-29|Toshiba Lighting & Technol Corp|Electromagnetic shield cover and electromagnetic shield part|
    JPH06104366A|1992-09-21|1994-04-15|Kawasaki Steel Corp|Semiconductor package and mounting method thereof|
    JPH07147495A|1993-11-26|1995-06-06|Nec Corp|Printed board surface mounting shield case|
    JP3023282U|1995-09-14|1996-04-16|モレックスインコーポレーテッド|Electrical connector|
    SE507255C2|1996-08-22|1998-05-04|Ericsson Telefon Ab L M|Screen Protectors|JP2013168508A|2012-02-15|2013-08-29|Seiwa Electric Mfg Co Ltd|Surface mounting clip|
    法律状态:
    2001-01-10| AS| Assignment|Owner name: ALPS ELECTRIC CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WATANABE, YOSHIKIYO;REEL/FRAME:011453/0215 Effective date: 20001201 |
    2002-03-01| STCB| Information on status: application discontinuation|Free format text: EXPRESSLY ABANDONED -- DURING EXAMINATION |
    优先权:
    申请号 | 申请日 | 专利标题
    JP2000-017951||2000-01-24||
    JP2000017951A|JP2001210971A|2000-01-24|2000-01-24|Transmitter-receiver unit|
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